EMS Backend Technology
SMT
SMD components BGA/LGA, FC, SOIC etc.
Flip Chip
underfill, Soldering, isotropic bond, soldering, underfill ultrasonic etc.
EMS COB
Dispense, Dipping, soldering, gold wire, etc.
Wafer backend
incoming inspection, wafer dicing, grinding, assembly etc.
complete process from Chip to complete optical module etc.
EMS Opto packaging
Highest placement precision o,5 µm, active + passive alignment
lens array alignment, EMS opto compound etc (Electronic Manufacturing Services).
MEMS – Micro-Electro-Mechanical Systems
Waferprocessing, Die bonding, Die placement, Wire bonding etc.
