Hybrid & Laser packaging
The package types range from TO-Can, Butterfly package, to Box build type.
- Die Attach: Eutectic & Epoxy +/- 1 um accuracy
- Wire Bonding: Ball & Wedge Deep access
- Optical Alignment & Attachment Active/Passive
- Hermetic Sealing & Leak Test
- Burn-In & Functional Test
- Special equipment like AMIGRA
High precision Die Attachment
Eutectic with wide range of solder alloys Thermocompression , thermosonic and ultrasonic Adhesive and UC Curing Better than 1µm postbonding accuracy
High precision Wire Bonding
Ball bond & stud bump with Au and Al wires Wedge bond with Au and Al wires Ribbon bond
Optical Alignments & Attachments
Submicron accuracy Laser welding, laser soldering, adhesives and mechanical testing
Hermetic Sealing
Seam welding,laser welding, glas sealing, and soldering
Burn In & Functional Testing
