EMS Technologies

Image sensor packaging

EMS/Service for Image Sensor packaging, for biomedical and industrial camera application

  • Clean Room Assembly (class 100)with ESD control
  • Wafer Dicing and Cleaning
  • Sie Attach: X-Y, Rotation &Tilt accuracy
  • Wire Bonding:  Ball & Wedge
  • Glas Lid Sealing
  • All Package Types: PCB,Flex, Ceramic, Metal etc.
  • µBGA, CSP, COB, Flip Chip, Leadfree