Image sensor packaging
EMS/Service for Image Sensor packaging, for biomedical and industrial camera application
- Clean Room Assembly (class 100)with ESD control
- Wafer Dicing and Cleaning
- Sie Attach: X-Y, Rotation &Tilt accuracy
- Wire Bonding: Ball & Wedge
- Glas Lid Sealing
- All Package Types: PCB,Flex, Ceramic, Metal etc.
- µBGA, CSP, COB, Flip Chip, Leadfree
