SMT & Box build Technology
SMT & Box Build
- Full range of manufacturting services from PCBA to complete box build of electronic and optoelectronic devices, modules and subsystems including RF/Microwafe,Power electronic etc.)
Our key SMT capabilities are: Workmanship: IPC-610F Class 1, 2, & 3b Max Board Size:470mm x470mm
Component Mounting: passive : 0201 and 01005, IC Package : all types, (µBGA, CSP, Flip Chip, COB) - DFM & DFX
- Lead-free soldering
Functional Test (FCT), automated Optical Inspection (AOI), X-Ray &SAM - Prototype to volume manufacturing
