EMS Technologies

SMT & Box build Technology

SMT & Box Build

  • Full range of manufacturting services from PCBA to complete box build of electronic and optoelectronic devices, modules and subsystems including RF/Microwafe,Power electronic etc.)
    Our key SMT capabilities are: Workmanship: IPC-610F Class 1, 2, & 3b Max Board Size:470mm x470mm
    Component Mounting: passive : 0201 and 01005, IC Package : all types, (µBGA, CSP, Flip Chip, COB)
  • DFM & DFX
  • Lead-free soldering
    Functional Test (FCT), automated Optical Inspection (AOI), X-Ray &SAM
  • Prototype to volume manufacturing