Manufacturing Capabilities
focuz2020-10-20T11:37:39+02:00EMS Manufacturing Capabilities and Specialties
- Hybrid assemblies & packaging
Lasers, photodiodes, image sensors, MEMS, sensors, LIDAR etc. - Optical Assemblies
Passive components, amplifiers (EDFA), CATV splitter box etc.
TOSA/ROSA, transceiver
AOC, Optical HDMI & USB cables etc. - Fiber Optic Patch Cords
FC, LC, SC, E2000, MTP/MPO, Prizm, etc - PCBA
(including RF/Microwave, Power electronic, etc.)
All package types: 01005 passive μBGA CSP, COB, Flip Chip PCB, etc.
bond technics: IPC workmanship standard, leadfree etc. - Box Build
Full range of services from PCBA to complete box build