Manufacturing Capabilitiesfocuz2020-10-20T11:37:39+02:00EMS Manufacturing Capabilities and Specialties Hybrid assemblies & packaging Lasers, photodiodes, image sensors, MEMS, sensors, LIDAR etc. Optical Assemblies Passive components, amplifiers (EDFA), CATV splitter box etc. TOSA/ROSA, transceiver AOC, Optical HDMI & USB cables etc. Fiber Optic Patch Cords FC, LC, SC, E2000, MTP/MPO, Prizm, etc PCBA (including RF/Microwave, Power electronic, etc.) All package types: 01005 passive μBGA CSP, COB, Flip Chip PCB, etc. bond technics: IPC workmanship standard, leadfree etc. Box Build Full range of services from PCBA to complete box build