Manufacturing Capabilities
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EMS Manufacturing Capabilities and Specialties
- Hybrid assemblies & packaging
Lasers, photodiodes, image sensors, MEMS, sensors, LIDAR etc.
- Optical Assemblies
Passive components, amplifiers (EDFA), CATV splitter box etc.
TOSA/ROSA, transceiver
AOC, Optical HDMI & USB cables etc.
- Fiber Optic Patch Cords
FC, LC, SC, E2000, MTP/MPO, Prizm, etc
- PCBA
(including RF/Microwave, Power electronic, etc.)
All package types: 01005 passive μBGA CSP, COB, Flip Chip PCB, etc.
bond technics: IPC workmanship standard, leadfree etc.
- Box Build
Full range of services from PCBA to complete box build